Huawei is a leading telecom solutions provider. Through continuous customer-centric innovation, Huawei has established end-to-end advantages in Telecom Network Infrastructure, Application & Software, Professional Services and Devices. With comprehensive strengths in wireline, wireless and IP technologies, Huawei has gained a leading position in the All-IP convergence age. Its products and solutions have been deployed in over 100 countries and have served 45 of the world's top 50 telecom operators, as well as one third of the world's population.

5* Talents in Photonics Silicon Optical Laser 3D Sensing ...

Projects & tasks:

  1. Photonic Chip
  • Photonic chip design/process: Will collaborate on the photonic chip research and design, modeling and simulation; will collaborate on the photonic chip process development and research, optimization and improvement.
  • Photonic chip epitaxy: Will collaborate on the epitaxial material growth; operating the equipment, writing operating procedures, and daily maintenance of the equipment.


  1. Silicon Photonics
    • Silicon photonics chip design: Will collaborate on the testing and analysis of silicon photonic chips; Will collaborate on the process design and process realization of silicon photonic Fab.
    • Silicon photonics chip design: Will collaborate on the simulation and design of silicon photonic chips.
    • Silicon photonics package design: Will collaborate on the packaging of silicon photonic chips and devices.


  1. Optical Device
  • Optoelectronic integrated packaging: Will collaborate on the packaging solutions of optoelectronic integrated devices, participate in the planning and research of advanced packaging technologies in the industry, undertake the simulation and verification of optical/electrical/mechanics/processes in the development process of optical devices, and analyze the design, process and reliability of the device development process and other issues.
  • Optoelectronic integrated signal integrity : Will collaborate on the optoelectronic integrated design of high-speed optoelectronic devices, participate in the industry's advanced optoelectronic integration technology planning and research, undertake high-speed optical/electric chip modeling and simulation, provide optoelectronic integrated high-frequency packaging solutions, and analyze the integrity issues of the
  • Thermal stress simulation design: Undertake the thermal, deformation and mechanical analysis in the process of new product development, guide and optimize product design, process design and reliability evaluation.
  • WSS process: WSS overall process integration scheme design, involving optics, machinery, packaging, heat/thermal, stress, materials and other fields. Review the rationality and risk of design in various fields, and lead the completion of the formulation and implementation of risk verification measures, as well as the root cause analysis and resolution of abnormal problems.
  • LCOS: Will collaborate on algorithm research and optimization, modeling and simulation of LCOS spatial phase modulator.


  1. Laser Display
    • Light path design: Will collaborate on polarization illumination/imaging geometric optical path design and modeling, photometric and colorimetric simulation, and completion of optical component test cases.
    • Optical process: Will collaborate on the design of the optical machine assembly process, and the analysis and optimization of the coupling container of the light source/optical element/display panel.


  1. 3D Sensing
  • 3D sensor Engineer: Will collaborate on 3D image sensor or silicon-based PD pixel design process, circuit design process or system design; undertake modeling simulation and test result analysis.


  1. Imaging Optics
  • Imaging optics Engineer: Will collaborate on the simulation design of the optical system or optical structure, the selection of optical devices, and the performance evaluation and optimization of optical components.


  1. Laser Technology
  • High-power laser technology research and development: Will collaborate on the system design and optimization of high-power gas lasers, solid-state lasers, semiconductor lasers, and fiber lasers, participate in the planning and research of advanced laser light source technologies in the industry, and undertake laser modeling, simulation, and reliability testing.



  • Being a fresh Master in Electrical Engineering, Physical Sciences or Computer Science
    • or PhD qualification is preferred
  • 1 Study field or Laser Technology or Imaging Optics or Laser Display or 3D Sensing, Photonic Chip or Silicon Photonics or Optical Device or any other 56+ key technology directions of Huawei
  • Being a Competition winner (ex. ICPC, IMO, IMC etc.) OR being a Scientific Researcher with publications & patents award (ex.
  • Attitude
    • Strong team player
    • Excellent written and oral communication skills
    • Eye for detail but also able to take high-level perspective when appropriate
    • Organized, structured worker
    • Continuous improvement spirit

Your application will be evaluated by the HR department of Huawei R&D Sites in Belgium and the Netherlands itself. For any additional feedback regarding your application, we kindly refer you to the Huawei R&D Sites in Belgium and the Netherlands HR department.


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