Huawei is a leading telecom solutions provider. Through continuous customer-centric innovation, Huawei has established end-to-end advantages in Telecom Network Infrastructure, Application & Software, Professional Services and Devices. With comprehensive strengths in wireline, wireless and IP technologies, Huawei has gained a leading position in the All-IP convergence age. Its products and solutions have been deployed in over 100 countries and have served 45 of the world's top 50 telecom operators, as well as one third of the world's population.

3D IC Integrated Expert

Huawei is a leading telecom solutions provider. Through continuous customer-centric innovation, Huawei has established end-to-end advantages in Telecom Network Infrastructure, Application & Software, Professional Services and Devices. With comprehensive strengths in wireline, wireless and IP technologies, Huawei has gained a leading position in the All-IP convergence age. Its products and solutions have been deployed in over 100 countries and have served 45 of the world's top 50 telecom operators, as well as one third of the world's population.

Assignment Description We are offering a long term 3D IC Integrated senior expert position.

The responsibility includes:

Participate in key chip projects in AI/CPU, mobile phone, network and other fields, and be responsible for the following aspects:

  1. Output a competitive 3DIC engineering architecture according to the application scenarios and needs of the product.
  2. Decompose the engineering structure into implementable engineering plans, identify and perform 3DIC risk management, and finally transform the technology Idea into commercial success.
  3. Combined with the industry's best 3DIC engineering practice and industry analysis, carry out innovative research and industry-leading exchange of cutting-edge technology. Work with Vendor jointly to customize 3DIC technology suitable for HiSilicon, thus supporting HiSilicon to continuously be the lead in the 3DIC field.

Required Education and Experience:

  • More than 3 years of work experience in related companies in the industry, technical team leader or senior expert.
  • Having FAB work background, familiar with Wafer process, and has many successful 3DIC experience.
  • The background and experience of Wafer Process Integration are required. And it’s best to have the experience covering any of the two items: 1) BEOL Process Integration; 2) Wafer Level Package Process Integration; 3) 2.5D Interposer/3DIC process integration including TSV Process, Chip to Wafer Process, wafer to wafer process, etc.
  • Good teamwork ability, good communication skills. Excellent analytical skills.

Location: Belgium Leuven, 100% on site

Your application will be evaluated by the HR department of Huawei R&D Sites in Belgium and the Netherlands itself. For any additional feedback regarding your application, we kindly refer you to the Huawei R&D Sites in Belgium and the Netherlands HR department.

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